Static-dissipative grade
ESD / Static Dissipative Foam
- Surface Resistivity
- 10⁶–10⁸ Ω/m²
- Application
- Electronic items packaging
- Colour
- Jet Black
- Density
- 85 ± 5 kg/m³
- Standard Finish Thickness
- 44 ± 2 mm
- Minimum Slice Thickness
- 2 mm

ESD Foam Sheet Manufacturer India
Static-dissipative and conductive foam solutions for protecting PCBs, electronic components, sensors, connectors and precision equipment during handling, storage and transportation.
Send your drawing, component dimensions, sample or packaging requirement for a material and fitment recommendation.
ESD / Static Dissipative
10⁶–10⁸ Ω/m²
C-Conductive
10³–10⁵ Ω/m²
Product Overview
NestPack supplies ESD foam sheets and conductive foam sheet material for electronics packaging, then converts the selected grade into sheets, pads, trays, inserts and complete protective packs. Buyers can send a drawing, sample or component dimensions for an application review.
Our custom ESD foam fitments support PCB packaging, IC and semiconductor-related components, sensors, connectors, control modules, electronic assemblies, precision instruments and electronics transit packaging. Material selection should be validated for the ESD-sensitive component and complete packaging system.

Compare the supplied material grades, then ask NestPack to review the component and packaging configuration before production.
Static-dissipative grade
Conductive grade
Side-by-side data for ESD / static-dissipative and C-Conductive foam grades.
| Property | ESD / Static Dissipative | C-Conductive | Test method |
|---|---|---|---|
| Colour | Jet Black | Jet Black | — |
| Standard Length | 2250 mm (+50/-10) | 2200 mm (+50/-10) | — |
| Standard Width | 1150 mm (+30/-10) | 1100 mm (+30/-10) | — |
| Standard Finish Thickness | 44 mm (±2) | 44 mm (±2) | — |
| Density | 85 ± 5 kg/m³ | 85 ± 5 kg/m³ | ASTM D3575 |
| Hardness | 25 ± 3 Shore A | 25 ± 3 Shore A | ASTM D2240 |
| Tensile Strength @ Break | >6 kg/cm² | >6 kg/cm² | ASTM D412 |
| Elongation @ Break | >50% | >50% | ASTM D412 |
| Compression Strength @ 25% | >1.0 kg/cm² | >1 kg/cm² | — |
| Compression Set @ 50% | <14% | <15% | — |
| Tear Strength | >2 kg/cm | >2 kg/cm | ASTM D624 |
| Rebound Resilience | >100 mm | >100 mm | ASTM D2632 |
| Surface Resistivity | 10⁶ to 10⁸ ohm/m² | 10³ to 10⁵ ohm/m² | ASTM D257 |
| Minimum Slice Thickness | 2 mm | 2 mm | — |
Specifications are based on the supplied Capcell product specification dated 12.08.2024. Actual application performance should be validated for the intended packaging application.
| Property | ESD / Static Dissipative | C-Conductive |
|---|---|---|
| Surface Resistivity | 10⁶–10⁸ Ω/m² | 10³–10⁵ Ω/m² |
| Application | Electronic items packaging | Electronic items packaging |
| Colour | Jet Black | Jet Black |
| Density | 85 ± 5 kg/m³ | 85 ± 5 kg/m³ |
| Standard Thickness | 44 ± 2 mm | 44 ± 2 mm |
| Minimum Slice | 2 mm | 2 mm |
Not sure which grade you need? Send us your application and component details.
Ask an EngineerIn-house conversion
NestPack converts conductive XLPE foam and conductive EVA foam formats into application-specific protective packaging for electronics and industrial equipment.
Protective packaging for PCB assemblies and electronic boards.
Protect sensitive electronic components during handling and transportation.
Foam packaging solutions for sensitive semiconductor-related components.
Custom cavities and protective separators for precision components.
Custom foam fitments for instruments and control equipment.
Protective packaging for electronic modules and assemblies.
NestPack Private Limited is an ESD foam manufacturer in Whitefield Bengaluru, supporting OEM and contract-manufacturing requirements from material selection through complete transit packaging.
NestPack can provide the foam component as well as the complete protective packaging configuration.
NestPack is an ESD foam manufacturer in Bengaluru and conductive foam supplier serving India from Sy No 100/4, Kaithota Road, Nagondanahalli, Whitefield, Bengaluru – 560066, Karnataka, India. We support electronics, EMS, PCB, semiconductor-related, medical electronics, aerospace electronics, defence electronics and industrial equipment buyers with sheets and converted fitments.
For ESD packaging solutions in Bengaluru or pan-India supply, share the component, expected handling, quantity and outer-pack requirement so the engineering team can review the full configuration.
Technical specification available on request. Supplier documentation is shared directly where appropriate.
Engineering enquiry
Send your component dimensions, drawing, photograph or sample. Our team can review your requirement and recommend the suitable ESD or conductive foam configuration.
ESD foam is a static-dissipative packaging material designed to allow electrostatic charge to dissipate in a controlled way. It is used around electronics and other static-sensitive components after the complete packaging system has been assessed for the application.
Conductive foam is a lower-resistance foam grade used in packaging configurations where electrical conductivity is required. NestPack's listed C-Conductive grade has a surface resistivity of 10³ to 10⁵ ohm/m² according to the supplied material specification.
The primary distinction is surface resistivity. The ESD / static-dissipative grade is specified at 10⁶ to 10⁸ ohm/m², while the C-Conductive grade is specified at 10³ to 10⁵ ohm/m². The suitable grade depends on the component and packaging system.
The ESD / static-dissipative grade is specified at 10⁶ to 10⁸ ohm/m² in the supplied Capcell product specification dated 12.08.2024.
The C-Conductive grade is specified at 10³ to 10⁵ ohm/m² in the supplied Capcell product specification dated 12.08.2024.
The standard finished block thickness is 44 ± 2 mm, with a listed minimum slice thickness of 2 mm. Ask our engineering team to confirm the practical sheet and insert build for your requirement.
Yes. NestPack can CNC-cut ESD foam into cavities, trays and fitments based on a drawing, component dimensions or an approved sample.
Yes. We convert ESD and conductive foam into CNC-cut or die-cut inserts, trays, separators, pads, layered fitments and complete protective packaging configurations.
ESD foam can be considered for PCB packaging, including trays and separators. The foam grade and complete pack design should be selected and validated for the specific board and handling conditions.
Yes. NestPack supplies ESD and conductive foam sheets and converted fitments from Whitefield, Bengaluru to electronics and industrial buyers across India.
Yes. We can supply conductive foam sheets, pads, trays and custom inserts for electronic components after reviewing the component, pack configuration and handling requirement.
Yes. Send a PDF, DXF, DWG, STEP, image, component dimensions or physical sample. NestPack can review it and propose a suitable foam grade and converted packaging format.