Anti-static, dissipative and conductive foam fitments engineered in Bengaluru 560066 for PCB and SMT lines, semiconductor sub-assemblies, instrument cases and connector kits. ANSI/ESD S20.20 aligned material selection, RoHS-compliant grades and CNC-cut precision — supplied to EMS, semiconductor and instrument OEMs across India.
An electronics foam insert has two jobs — mechanical cushioning and electrostatic control — and they trade off differently for a bare-die semiconductor than for a fully assembled bench instrument. The wrong ESD grade can either fail to protect a 10 V-sensitive component or, worse, ground a live PCB through its metal chassis.
We design every electronics fitment around six engineering pillars, matched to ANSI/ESD S20.20 and IEC 61340-5-1 references, so the resistivity, density and geometry actually fit your line and your product's ESD class.
Anti-static, dissipative and conductive grades matched to the ESDS component's sensitivity class.
Tool-controlled cavities sized to your PCB panel, SMT carrier or wafer FOUP tote.
Cushioning density chosen against the instrument's fragility curve, not a generic thickness.
Multi-layer trays with rigid separators and lid foam for reflow-oven and inter-plant transit.
Closed-cell, skin-finished foams that don't shed fibre into connectors or optical ports.
Supplier RoHS and REACH declarations passed through for EU-facing electronics OEMs.
Component class, HBM sensitivity, handling environment and grounding scheme.
STEP / IGES / DXF / DWG under NDA — or a physical PCB / instrument sample.
Anti-static PE, dissipative XLPE, conductive PU or high-density support foam per zone.
CNC-machined sample, in-line trial with your ESD-safe carriers, drop and compression validation.
Supplier resistivity range and RoHS / REACH declarations filed with the customer quality record.
Batch CNC with colour-coded ESD zones, serialised trays and controlled dispatch from Bengaluru 560066.
| Material & density | Compression set | Typical electronics use |
|---|---|---|
| Anti-static pink PE (30 kg/m³) | Low (~12%) | General PCB handling, light connector kits |
| Anti-static pink PE (60 kg/m³) | Low (~10%) | Stackable SMT carrier trays, sub-assembly transport |
| Dissipative XLPE | Low (~8%) | Instrument cases, semiconductor sub-assembly cradles |
| Conductive black PU | Recovers fully | IC / ESDS component pin-shorting, high-sensitivity carriers |
| XLPE 90 kg/m³ (support) | Low–Medium (~8%) | Structural cushioning under ESD contact face |
| PU ester (skinned) | Recovers fully | Optical ports, lens-mounted PCBs, sensor modules |
Resistivity ranges are supplier-declared for the grade; final compliance depends on test method (ASTM D257) and the customer's ESD control program.
NestPack designs and documents electronics foam fitments aligned to the references below. We do not claim independent ESD certification of finished trays — that sits with the customer's ESD control program audit.
ESD control program reference — our materials sit in the low-charging and dissipative categories.
International ESD control standard — resistivity ranges we design around.
PCB handling and storage reference — informs closed-cell surface finish choice.
Material declarations for foams supplied into EU electronics OEMs.
Substance-of-very-high-concern declarations from our foam suppliers, passed through on request.
Surface resistivity and foam density / compression-set test references.
EMS line was seeing solder-joint stress after depanel on multi-layer boards sitting on a rigid tote.
Anti-static pink PE 60 kg/m³ carrier tray with panel-shaped cavity and matching lid foam for stackable transit.
Depanel scrap dropped and inter-plant transit damage eliminated on the pilot line.
Bench-top oscilloscope was arriving at field-service sites with knob shafts bent from courier drops.
XLPE 90 kg/m³ dissipative cradle with capture features on the fascia, inside an IP-rated hard case.
Field-service warranty returns for cosmetic and knob damage went to near-zero.
Semiconductor sub-assembly was picking up 200–400 V of triboelectric charge during inter-plant transit.
Dissipative XLPE tray with a conductive PU pin-shorting layer and grounded tote-level bonding path.
Verified charge on receipt stayed below the customer's 100 V handling threshold.
Anti-static foam (surface resistivity 10⁹–10¹¹ Ω/sq) prevents triboelectric charge build-up during handling. Static-dissipative foam (10⁶–10⁹ Ω/sq) drains an existing charge safely to ground. Conductive foam (below 10⁴ Ω/sq) is used for shorting pins on ICs and highly ESD-sensitive components. We supply all three grades — pink anti-static PE, dissipative XLPE and black conductive PU — from our Bengaluru 560066 facility.
Yes. We CNC-machine anti-static and dissipative foam trays sized to your PCB panel or SMT carrier. Trays can be stacked, colour-coded per line, and supplied with matching lid foam for reflow-oven and depanel storage in Indian EMS plants.
Yes. Our anti-static PE, dissipative XLPE and conductive PU foams carry supplier RoHS and REACH declarations, which we pass through on request for electronics OEMs shipping into EU markets.
Yes. We machine XLPE, PU and anti-static foam inserts for oscilloscopes, spectrum analysers, hand-held test gear, wafer FOUP totes and semiconductor sub-assembly transporters. Designs are driven by CAD, a physical sample or 3D scan under NDA.
Prototype samples ship in 5–8 working days from our Bengaluru facility once CAD or a physical sample is approved. Production batches run in 2–4 weeks depending on density, ESD grade and quantity.
Send PCB or instrument drawings, CAD or a sample — we'll engineer the anti-static foam tray from our Bengaluru 560066 facility.
